Electroless deposition (ED) or electroless plating is an autocatalytic process through which metals and metal alloys are deposited onto conductive and nonconductive surfaces.[1][2][3][4] These nonconductive surfaces include plastics,[5] ceramics, and glass etc., which can then become decorative, anti-corrosive, and conductive depending on their final functions.[2] Electroplating, unlike electroless deposition, only deposits on other conductive or semi-conductive materials when an external current is applied.[6][7] Electroless deposition deposits metals onto 2D and 3D structures such as screws, nanofibers,[5] and carbon nanotubes, unlike other plating methods such as Physical Vapor Deposition ( PVD), Chemical Vapor Deposition (CVD), and electroplating, which are limited to 2D surfaces.[8] Commonly the surface of the substrate is characterized via pXRD, SEM-EDS, and XPS which relay set parameters based their final functionality.[6] These parameters are referred to a Key Performance Indicators crucial for a researcher’ or company's purpose.[6][9] Electroless deposition continues to rise in importance within the microelectronic industry, oil and gas, and aerospace industry.[10]