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Thermal design power

This article is about the thermal design envelope of microprocessors. For the general concept, see power rating.
Heatsink made of aluminum fins and core mounted on a motherboard, with an approximately half hand-sized fan attached on the top of it. The aluminum core of the heatsink contacts the 40x40mm CPU surface underneath it, taking heat away through thermal conduction. This heatsink is designed with the cooling capacity matching the CPU’s TDP
Heatsink mounted on a motherboard, cooling the CPU underneath it. This heatsink is designed with the cooling capacity matching the CPU’s TDP.

Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is designed to dissipate during normal operation at a non-turbo clock rate (base frequency).

Some sources state that the peak power rating for a microprocessor is usually 1.5 times the TDP rating.[1]

  1. ^ John L. Hennessy; David A. Patterson (2012). Computer Architecture: A Quantitative Approach (5th ed.). Elsevier. p. 22. ISBN 978-0-12-383872-8.
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